Insulated substrate
This is a high heat dissipation, high insulation metal substrate that achieves "thin film high insulation" by applying a 20μ thick layer of Nippon Paint's "Insulid" using ED electrophoretic coating.
Insulreed is applied to the base metal plate during the bath to form an electroplated coating, creating an insulation layer. The 20μ thick Insulreed insulation layer has an insulation performance of over 5kV and is the highest specification resin layer for thin film high insulation. On top of the insulation layer, circuits can be low-temperature fired with a highly conductive paste, allowing all processes to be completed through printing. Since it does not require treatment with strong acids or strong alkalis involved in substrate manufacturing, it is possible to directly print circuits onto die-cast molded products or heat sinks exceeding 200mm in height as an integrated heat dissipation substrate. As everything is manufactured using printing methods, it is also an eco-friendly substrate that is gentle on the environment.
- Company：ＴＳＳ
- Price：Other
